Plating Different Roles

1. Copper: base, enhancing electroplating adhesion capacity and corrosion resistance. (Copper easily oxidized, oxidized, verdigris no longer electrical conductivity, copper products must be copper plated protection).

2. Nickel: base or appearance, ability to improve corrosion resistance and wear resistance, (chemical nickel more than chrome for wear in the modern ability). (Note that many electronic products, such as DIN, n, no longer use nickel base, mainly due to nickel have magnetic, will affect the electrical properties of passive intermodulation).

3. Gold: improve conductive contact resistance, improve signal transmission. (Goldthe most stability, but also the most expensive. )

4. Palladium nickel: improve conductive contact resistance, improve signal transmission, resistance to wear than gold.

5. Tin-lead: to increase welding capacity, fast get replaced by other (due to lead most to bright tin plating and matte tin).

6. Silver: improve conductive contact resistance, improve signal transmission. (Bestsilver, easily oxidized, oxidized conductive).